| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board on which an electric circuit is constituted by forming a circuit pattern by sticking copper foil to an insulating resin material and etching off the copper foil and which can be prevented from warping, and to provide a method of manufacturing the circuit board. SOLUTION: On the surface of the printed circuit board 1, electrically unnecessary areas 4 which are electrically unnecessary and increase the rigidity of the board 1 are provided by leaving non-etched portions of the copper foil 9. Because of the electrically unnecessary areas 4, the interface area between the insulating resin material and copper foil 9 is adjusted and, at the same time, the rigidity of the circuit board 1 is increased. Therefore, the warping of the board 1 can be suppressed by balancing the difference between the coefficients of thermal expansion of the insulating resin material and foil 9 with the composition of force to the resin material.
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