| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for machining a raw-material single crystal ingot so that it can be sliced in a wafer without losing the weight of the grown silicon single-crystal ingot as much as possible, and without being subjected to impurity contamination. SOLUTION: In this machining method for slicing a wafer from the grown silicon single-crystal ingot, prior to slicing the wafer, when the side of the single-crystal ingot 10 is ground for machining, a process for grinding and removing merely a crystal habit line 31 appearing at least in the ingot is made.
|
