NONCONTACT SENSOR FOR TESTING SHORT STATUS OF FINE CIRCUIT BOARD

摘要

PURPOSE: A noncontact sensor is provided to quickly and exactly test whether a plurality of fine circuit patterns which are manufactured in a film form and installed on one PCB is short. CONSTITUTION: A substrate(11) is formed by a resin. A copper foil(12) is laminated at an outer portion of the substrate(11) to have uniform thickness. An insulating layer(14) is coated at a surface of the copper foil(12) to have a uniform thickness. A signal sensor pattern(16) is formed at a upper portion of the copper foil(12). A plurality of through holes are formed at a center of the substrate(11). A copper is deposited in the copper foil(12) and an inside of the through holes. A sensor line is soldered to the copper foil(12) through a sensor electrode and a shielding electrode. The sensor line is connected to an external measuring device. The sensor electrode is electrically connected to the signal sensor pattern through the through holes.