| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device superior in insulation withstand voltage characteristic and heat resistant cycle and rich in reliability. SOLUTION: The semiconductor device comprises a heat sink 5, an insulation board 1 on the heat sink 5, surface side conductor plates 21, 22, 23 arranged selectively on the insulation plate 1, semiconductor chips 31, 32 arranged on the surface side conductor plates 21, 22, 23, a solid insulator 11 brought into contact with the outer peripheral ends of the surface side conductor plates 21, 22, 23 and arranged on the upper face of the insulation board 1, a case 6 provided on the heat sink 5 so as to surround the insulation board 1, and a soft insulator 9 filled into the case 6. The solid insulator 11 has an intermediate thermal expansion coefficient between the thermal expansion coefficients of the surface side conductor plates 21, 22, 23 and the insulation board 1. |
