| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film capacitor minimized in thickness from a board to an external terminal electrode (salient pole), a method for manufacturing the same and its mounting structure. SOLUTION: The thin-film capacitor comprises a capacitor body formed by coating a lower electrode 11, a thin-film dielectric layer 12 and an upper electrode 13 on the surface of an insulating board 1 having a plurality of through-holes 2 and second through-holes 3 penetrating in a board thickness direction, a first salient pole 15 embedded in a lower electrode 11 part on the hole 2, and a second salient pole 16 embedded in an upper electrode 13 part on the hole 3. The poles 15 and 16 are obtained by suction through the holes 2 and 3 before curing. This thin-film capacitor 10 is disposed underneath an IC chip 50.
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