| 摘要 |
PROBLEM TO BE SOLVED: To improve electrical connecting reliability and productivity of a printed circuit board. SOLUTION: A method for manufacturing the printed circuit board comprises the steps of providing a hole 4 in a copper-clad laminate 5 on which a copper foil 3 is laminated, adhering a conductor sheet 8 having an adhesive layer 6 on the laminate 5, and exposing a copper foil 7 of the sheet 8 via the hole 4 by laser processing. The method further comprises the steps of forming a conductor pattern 10 for interlayer-connecting the sheet 8 adhered to a lower surface of the laminate 5 to the foil 7, and forming a circuit pattern 11 by etching or the like based on the pattern 10 and the foil 7 of the sheet 8 to manufacture the board 1 having a non-penetrating via hole 2 in a front layer. Thus, the copper-clad laminate 5 can be perforated without apprehension of exudating an adhesive, and the adhesive can be efficiently and accurately removed. Accordingly, the electrical connecting reliability and the productivity of the printed circuit board can be improved.
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