| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow spattering system for flattening an aluminum or copper material at a relatively low temperatures of 400 deg.C or lower by extending a PVD technique and carrying out uniform reflow on the whole surface of the substrate even with a large diameter. SOLUTION: The spatter system has a spattering chamber in a PVD system and a reflow chamber for heating a substrate in a multi-chamber method. The problem is solved in the reflow spattering system by using a reflow chamber with a heating mechanism in the following constitution. The cross section of an inner wall in a heating frame is elliptic. The heating source and the substrate are so located that the heating source is put near one focal point of the ellipse and the surface of the substrate is put near the other focal point. The substrate can be rotated with a center of a long diameter of the ellipse between these focal points or can be also removable linearly in at least a direction crossing to the long diameter of the ellipse between these focal points at the same time.
|
