| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer grinding head, which can increase the lifetime of a flexible film and obtain accuracy of grinding a wafer, and a grinding apparatus using the same. SOLUTION: A head body 106 is formed which has an opening 106a on a lower part and is substantially formed into a disc, and a pressuring chamber 107 is formed which is extended in the head body 196 and is separated from the outside in the opening 106a. Further, a flexible film 2 is provided for supporting a wafer W on a lower surface of an inner periphery 2a, and a pressure regulating mechanism is provided for adjusting an internal pressure of the pressurizing chamber 107. An outer periphery 2b of the flexible film 2 is larger in thickness than the inner periphery 2a of the flexible film 2 that is a part for supporting the wafer W. |
