发明名称 ASSEMBLING PLATE OF BUNDLE OF WIRE MATERIALS
摘要 PROBLEM TO BE SOLVED: To provide a low cost assembling plate of a bundle of wire materials, which can reuse a full-scale drawing many times by attaching an assembling tool to a transparent plastic board without making holes on the full-scale drawing. SOLUTION: The full-scale drawing 11 written the wiring state of wire harness, plywood 12 having the full-scale drawing 11, the transparent plastic board 14 on which has at regular intervals a plural opening part 14a to hold the assembling tool 21 to support the wire harness when the wire harness is wired and a reinforcing frame 15 which is equipped around the board 14 to reinforce the board 14 are formed. With putting plywood 12 on the reinforcing frame 15, the full-scale drawing 11 is visible through the board 14.
申请公布号 JP2002075085(A) 申请公布日期 2002.03.15
申请号 JP20000260957 申请日期 2000.08.30
申请人 SUMITOMO WIRING SYST LTD 发明人 MORI AKIHIRO
分类号 H01B13/012;H01B13/00 主分类号 H01B13/012
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