| 摘要 |
PROBLEM TO BE SOLVED: To provide cooling structure for preventing fine particles and vapor in the fresh air from adhering to electronic components and for readily coping with the variation of height dimensions of the electronic components. SOLUTION: A cooling member 1 is used, where a seat 3 for soldering is formed around the electronic components 2 mounted to a substrate 4, the bottom surface is brought into contact with the surface of the electronic components 2 nearly in a measure shape, and its outer end section 12 is soldered to the seat 3 for soldering for covering, so that the electronic components 2 are sealed. When the electronic components have large height, a U-shaped extension frame with a specific height dimension for adjusting the height dimension of the cooling member 1 may be pinched at the soldering section between the cooling member 1 and the substrate 4.
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