| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component in which a metal cover body can surely be joined on a ceramic package and is reduced in sizes. SOLUTION: An electronic component element 13 is housed in the casing-like ceramic package 12 whose one face is opened with a sealing conductor 15 joined around the opening by a bonding material 16. The metal cover body 14 is joined to the sealing conductor 15 of the ceramic package 12 and the electronic component 10 is provided. The sealing conductor 15 is composed of a package side part 15a and a cover body joining part 15b formed on the side of the metal cover body 4 of the package side part 15a and having a projection part P projecting outward. A joining material 16 is filled between the outward projection part P of the cover body joining part 15b and the ceramic package 12.
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