| 摘要 |
<p>PROBLEM TO BE SOLVED: To accurately and firmly mount a semiconductor element on the mounting part of a package body. SOLUTION: The package has a substantially flat plate-like lead frame 2 having a frame part 2a and a plurality of outside lead terminals 2b extended in a row toward the other from one of the inner edge of the frame part 2a, a metallized pad 6a joining the outside lead terminal 2b on one end face of a lower face on the mounting part 1b mounting semiconductor element 4 on an upper face and a package body 1 arranging the other end side on the frame part 2a of the other side. Looseness does not occur when it is mounted on a heater block.</p> |
