| 摘要 |
PROBLEM TO BE SOLVED: To inhibit large cutouts generated on a surface when dividing a ceramic plate, and also to provide a semiconductor device for inhibiting defective circuit on a ceramic substrate surface due to the cutouts. SOLUTION: When the ceramic plate is to be divided into a plurality of ceramic substrates, a first blade for dicing is used for forming a plurality of grooves on the first surface of the ceramic plate, and a second blade for dicing with narrower width than the first blade is used for cutting along the groove from the opposite second surface to divide the ceramic plate, thus inhibiting the large cutouts that can be easily generated especially on the second surface. Even if a conductor pattern is formed on the surface of the ceramic plate in advance, and, furthermore, the ceramic plate is divided after the semiconductor device is packaged for composing a circuit, the large cutouts cannot be easily generated, thus inhibiting the deflective circuit. |
