| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer board whose adhesion property does not decrease even if the area between layers is connected by a conductor bump, and the manufacturing method of such multilayer board. SOLUTION: Before copper foil 12 and 15 having a resin is laminated on intermediate wiring layers 1a and 1a' at the bottom side of the conductor bumps 2 and 2' for forming the interlayer connection of the multilayer board, a kind of etching is made using treatment liquid with such acid as a formic acid as a main constituent for roughening the surface of the intermediate wiring layers 1a and 1a', and the copper foil 12 and 15 having resin is laminated on the surface of the wiring layers, thus preventing a conventional blackening film from being formed on the wiring layer and hence reflecting nearly all laser beams even if the laser beams are applied in the next process, restraining heat generation, and maintaining the reliability in interlayer connection. |
