发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which enables formation of a capacitor element having stabilized characteristics, by suppressing the etching of a capacitor dielectric layer by a resist remover. SOLUTION: The method of manufacturing semiconductor device comprises a process of forming a lower electrode on a semiconductor substrate; a process of forming a dielectric layer on the lower electrode; a process of patterning the dielectric layer by etching with the resist as a mask; a process of heating a solution containing sulfuric acid and hydrogen peroxide; a process of adding hydrogen peroxide to the solution in a quantity so that the density of the hydrogen peroxide becomes as prescribed, preferably, 3.5 wt.% or lower; a process of removing the resist by dipping the semiconductor substrate including the resist in the solution, immediately after the supplementation of the hydrogen peroxide; and a process of forming an upper electrode on the dielectric layer.
申请公布号 JP2002076272(A) 申请公布日期 2002.03.15
申请号 JP20000252922 申请日期 2000.08.23
申请人 SONY CORP 发明人 NAKATAMARI SHINOBU
分类号 G03F7/42;H01L21/027;H01L21/306;H01L21/822;H01L27/04;(IPC1-7):H01L27/04 主分类号 G03F7/42
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