发明名称 HEAT SINK AND ELECTRONIC EQUIPMENT HAVING IT
摘要 PROBLEM TO BE SOLVED: To provide a heat sink which can be reduced in size and thickness and, at the same time, can be improved remarkably in heat dissipating effect at a low cost. SOLUTION: This heat sink 30 which is attached to equipment 10 to dissipate heat from a heat generating section 70 in the equipment 10 to the outside of the equipment 10 is provided with a heat pipe 50 the one end section of which is arranged at the same position as that of the heat generating section 70, a heat diffusing member 100 which is arranged between the heat pipe 50 and heat generating section 70, and a heat transfer sheet or grease in at least either one of a first junction 91 between the heat pipe 50 and heat diffusing member 100 and a second junction 92 between the member 100 and heat generating section 70.
申请公布号 JP2002076664(A) 申请公布日期 2002.03.15
申请号 JP20000258144 申请日期 2000.08.23
申请人 SONY CORP 发明人 OGASAWARA JUNICHI;KAYAMA TAKASHI;HASHIMOTO TOSHIO
分类号 F25D9/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D9/00
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