| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device in which a solid-state image pickup element chip can be prevented from warpage. SOLUTION: The solid-state imaging device is provided with a solid-state image pickup device chip 1 on which a plurality of solid-state image pickup devices 7 are mounted, a wiring board 2 connected to the chip 1 to transmit signals from respective chips 7, and a protection cap 3 provided on the light incident side of the chip 1 to protect the chip 1. In this device, the chip 1 is provided on a substrate 4 having the same thermal expansion coefficient as that of the cap 3, and the substrate 4 and the cap 3 are sealed with a sealing resin 8. |
