| 摘要 |
PROBLEM TO BE SOLVED: To perform die plate release smoothly even if fine pitch process is advanced at the time of printing solder paste onto a connection terminal on a substrate using a print mask. SOLUTION: A resist film 14 is provided on a substrate 12 around a connection terminal 13 provided on a substrate 12. The resist film 14 is 50-100μm thick and thicker than the connection terminal 13 while a print mask 15 is 20-40μm thick and thinner than the resist film 14. Since the print mask 15 is made relatively thin, die plate release can be performed smoothly even if fine pitch process is advanced.
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