发明名称 END-POINT DETECTION METHOD AND AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method for detecting an end point depending upon a change in color of an aqueous dispersion for a chemical mechanical polishing or color of polishing waste liquid during polishing, and the aqueous dispersion used for the method. SOLUTION: Depending upon a change in color of the aqueous dispersion for a chemical mechanical polishing on a polishing pad or a change in color of the polishing waste liquid discarded during chemical-mechanical polishing an end point of polishing is detected. The end point can be detected by using the aqueous dispersion containing a coupler has different colors during chemical- mechanical polishing performed on a polished film and after the polishing. When the polished film is a metallic film such as a Cu film, as a coupler, the aqueous dispersion can contain heteropolyacid or its salt that includes silicotungstic acid and phosphotungstic acid, or an organic acid or its salt that has a complex aromatic ring such as quinaldic acid and quinolinic acid. When the polished film is an insulating film such as a silicon dioxide film, the aqueous dispersion can contain a compound which is changed in color according to variation in pH of thymolphthalein, phenolphthalein, and so on.
申请公布号 JP2002075939(A) 申请公布日期 2002.03.15
申请号 JP20000261716 申请日期 2000.08.30
申请人 JSR CORP 发明人 HATTORI MASAYUKI;KAWAHASHI NOBUO
分类号 B24B37/013;C09K3/00;C09K3/14;H01L21/304;H01L21/306;H01L21/3205;H01L21/321;H01L21/768 主分类号 B24B37/013
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