| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board assuring a high adhesive strength of a ceramic board to a surface wiring conductor while suppressing an increase in a sheet resistance. SOLUTION: The circuit board 10 comprises the surface wiring conductor 2 formed on a surface of the ceramic board 1 and containing a metal component including a silver as a main component, a glass component and a metal oxide of a Cu2O or an MnO2. The conductor 2 contains the glass component and the metal oxide of a total sum of 0.1 to 30 pts.wt. with respect to 100 pts.wt. of the metal component. A roughness of an interface of the board 1 in contact with the conductor 2 is 5μm or more. |
