| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-transferring sheet that has improved thermal conductivity, appropriately adheres to a semiconductor device and a heat sink, and prevents ground leakage, between the semiconductor device and the heat sink. SOLUTION: In the sheet 6 having improved thermal conductivity, an elastic material 5 is combined with a net (enamel wire net) 4, where an enamel wire 3 whose wire material 1 with improved thermal conductivity is covered with an insulating layer 2, is knitted, and the enamel with net 4 is partially exposed to both front and rear surfaces. Since the front and rear surfaces are made of an elastic material 5 and the enamel wire 3, the heat-transferring sheet appropriately adheres to a semiconductor device and the heat sink. Also, since the enamel wire 3, having the wire material 1 with improved thermal conductivity inside, is distributed and combined in a net, while its one portion is exposed to the front and rear surfaces, the thermal conductivity is superior. Since the wire material 1 with improved thermal conductivity is covered with an insulating layer 2, it will not come into contact with the semiconductor device and heat sink, thus preventing ground leakage from the semiconductor device to the heat sink. |
