发明名称 MANUFACTURING METHOD OF CERAMIC WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for appropriately crimping the area between the layers of a green sheet laminate while accurately retaining a product shape in the manufacture of a ceramic wiring board. SOLUTION: A cavity 11 is formed as a sheet side recessed section that is open at the uppermost layer of the green sheet laminate 20 where a plurality of ceramic green sheets (a first layer 16, a second layer 14, and a third layer 12) are laminated, and a flexible elastic member 2 where a constant projection pattern is formed on the surface is overlapped to the green sheet laminate 20 so that the side of the projection pattern is located at the side of the recessed pattern. Then, by pressing the green sheet laminate 20 in the lamination direction by the flexible elastic member 2, the green sheet laminate 20 is pinched by the flexible elastic member 2 and a tool 40, and at the same time an elastic member side projection 4 is forcibly deformed when the projection 4 that does not correspond to the sheet side recessed section (cavity 11) is generated for allowing the elastic member side projection 4 to enter the cavity 11, thus crimping the area between the layers of the green sheet laminate 20.
申请公布号 JP2002076623(A) 申请公布日期 2002.03.15
申请号 JP20000252977 申请日期 2000.08.23
申请人 NGK SPARK PLUG CO LTD 发明人 MATSUDA KOJI
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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