| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board and a method for manufacturing the same capable of preventing releasing of a copper foil by enhancing an adhesive strength of the foil to an insulating prepreg. SOLUTION: The multilayer circuit board 18 is formed by laminating the copper foil 13 on an insulating core board 10 formed with a wiring pattern 10 via an insulating prepreg 12, inserting the prepreg 12 with a conductive bump 14 formed integrally with the foil 13, connecting to the pattern 11 of the board 10 by press bonding, and forming a wiring pattern 15 by the foil 13. In the board 18, the connecting surface of the prepreg 12 with at least the foil 13 is surface treated so as to improve its adhesive force. The surface treatment for improving the adhesive force can be executed by forming a rugged surface 16 on the prepreg 12, modifying the surface or forming a coated surface 17 having adhesive properties. |
