| 摘要 |
PROBLEM TO BE SOLVED: To realize high density mounting of electronic components easily. SOLUTION: The printed wiring board 1 comprises a glass epoxy base material 2, bumps 3 formed on the lower surface (terminal face) of the base material 2 by selectively removing a copper foil layer having a thickness corresponding to the height of an external connection terminal being formed, non-through holes 4 made from the upper surface of the base material 2 to reach a conductor layer, and a circuit pattern 5 formed on the upper surface of the base material 2 and connected electrically with the bumps 3 through the non-through holes 4. Since the individual bumps 3, i.e., the external connection terminals, have a substantially uniform height and a high accuracy in the height direction, flatness can be enhanced at a connecting part where a semiconductor chip is mounted and high density mounting of electronic components can be realized easily.
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