| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem due to the fact that a manufacturing method having high productivity has not been established in the case that a circuit device mounted with a circuit element as a ceramic board, a flexible sheet and the like are made support boards is miniaturized and thinned. SOLUTION: The opening part of a separation grove 61 is directed downward to be directed upward from the feed pipe 80 of an etching liquid provided downward of a conductive foil 60, and the etching liquid is showered. As the result, the part of the separation groove 61 contacting the etching liquid is etched, since the etching liquid is discharged immediately without making stagnant liquid in the separation groove 61, the depth of the separation groove 61 can be controlled in an etching processing time, and the uniform and highly precise separation grove can be formed. |
