发明名称 LEAD FRAME AND SAW FILTER EMPLOYING IT
摘要 PROBLEM TO BE SOLVED: To provide a lead frame that has a shape with high reliability of connection to a PWB(Printed Wiring Board) used for a mobile phone terminal or the like whose downsizing, weight reduction and high circuit integration are advanced, and to provide a SAW filter employing the frame. SOLUTION: Each of the lead frames 10 has an inner lead 1 and an outer lead 2, is placed in parallel, an interval A1 between the adjacent inner leads 1, an interval A2 between the adjacent outer leads 2, and also a width A3 of each inner lead 1, and a width A4 of each outer lead 2 can freely be selected so as to match with a wireless pattern or the like of the PWB. Furthermore, in the SAW filter 20, the lead frame 10 described above is fixed to a resin mold base 4, connected to a SAW chip 7 and a resin mold cap 5 covers the SAW filter 20.
申请公布号 JP2002076831(A) 申请公布日期 2002.03.15
申请号 JP20000257347 申请日期 2000.08.28
申请人 NEC CORP 发明人 SAKAI MINORU;YAMAMOTO TAIJI
分类号 H01L23/04;H01L23/08;H01L23/50;H03H3/08;H03H9/25;H03H9/64;(IPC1-7):H03H9/25 主分类号 H01L23/04
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