| 摘要 |
PROBLEM TO BE SOLVED: To provide a build-up multilayer printed wiring board which is excellent in thermal resistance, adhesion, durability, and dimensional accuracy, can be reduced in weight and thickness, and has a wiring that can be improved in density and reduced in thickness and to provide its manufacturing method. SOLUTION: Circuit conductor layers and an interlayer insulating layer are provided at least on the one side of an inner circuit board, and the conductor layers are electrically connected together to form a build-up multilayer printed wiring board. The interlayer insulating layer is formed of a heat-resistant film which has a linear expansion coefficient of -5 to 10 ppm/ deg.C and is 20μm or below in thickness and a thermosetting resin layer, and the circuit conductor layer is formed by plating. |
