发明名称 DIES FOR BUNDLING MULTICONDUCTOR CORDS
摘要 PROBLEM TO BE SOLVED: To provide dies, which can arrange cords in a multiconductor cord bundle and can complete the multiconductor cord bundle having a target cross section shape, regardless of viscosity of a coating material for bundling and a bundling rate. SOLUTION: Each of dies boies 8 has: a guiding aisle 12, which is formed into a shape of a cross section through which a plurality of cords 2 are got at a specified placement; a bundle shape formation aisle 15, which is formed into a shape of a cross section for a plurality of cords 2 to be bundled, coated with a coating material 3, and guided to the guiding aisle 12; and either of a convex portion 18 and a concave portion 19, which is formed inside the bundle shape formation aisle 15, at a concentration point of the coating material 3, and along the direction of the length of the bundle shape formation aisle 15.
申请公布号 JP2002075093(A) 申请公布日期 2002.03.15
申请号 JP20000269880 申请日期 2000.09.01
申请人 HITACHI CABLE LTD 发明人 TOYODA TOMOYUKI;HIRAMOTO YOSHIYUKI
分类号 H01B13/00;H01B13/24;(IPC1-7):H01B13/24 主分类号 H01B13/00
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