| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-quality integrated electronic component which can be readily obtained at a low cost, and to provide a method of assembling the same. SOLUTION: An electronic component 103 is housed and held in a component housing unit 102 of a first substrate 101. A second substrate 105 is electrically connected to the electronic component, so that an integrated electronic component is formed by the first and second substrates. Accordingly, the arrangement precision is determined, based on the arrangement precision of the component housing unit, and the movement of the electronic components housed in the component housing unit is restricted. Furthermore, since the electronic components need only be housed in the component housing unit, work time is reduced. Thus, arrangement of the electronic components can be readily achieved with higher precision and at a lower cost as compared with a conventional method. |
