| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a support board is not substantially needed and is an excessive material and the thickness of the support board large-sizes a circuit device mounting a circuit element as a printed board, a ceramic board, a flexible sheet and the like are made the support boards. SOLUTION: After a first trench 61 is formed on a first conductive foil 60A and a second trench 62 is formed on a second conductive foil 60B, the circuit element is mounted to fix an insulation resin 50 as the integrated conductive foil 60 is made the support board, after it is inverted, and at this time the connection part 64 of the second conductive foil 60B is etched as the insulation resin 50 is made the support board so as to be separated as a conductive path. Thus, the conductive path 51 and the circuit element 52 can realize the circuit device supported on the insulation resin 50 without employing the support board. Furthermore, pieces of wiring L1-L3 needed absolutely for the circuit exist, and slipping can be prevented because it has curved structures 59, 63 and a visor 58. |
