| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for connecting bumps at narrow pitch with no short circuiting with adjoining bumps after a pressure deformation of bumps with flip chip connection. SOLUTION: This method is provided for arranging the bumps 3 for flip-chip bonding a chip component 1 and a wiring board 5 through the bumps 3. The bump 3 are protruded electrodes formed on a plurality of pads 2. The pads 2 are formed side by side as electrodes on the surface of the chip component 1. The bumps 3 are arranged by alternately shifted in approximately perpendicular direction in which the pads 2 lines up. |
