| 摘要 |
PROBLEM TO BE SOLVED: To markedly reduce the number of pads required for detecting wiring defects, in a semiconductor device formed with a TEG(test element group). SOLUTION: An inspection pad 12 is electrically connected to one end of each of wiring regions 11a-11n, and a selector circuit 13 is electrically connected to the other end of each of the wiring regions 11a-11n. The selector circuit 13 is electrically connected by the inspection pad 15 and each of signal pads 14a-14n. In response to selection signals inputted from the signal pads 14a-14n, the selector circuit 13 electrically connects the inspection pad 15 to a specified wiring region among the wiring regions 11a-11n and detects wiring defects of the wiring region which is electrically connected to the inspection pad 15.
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