| 摘要 |
PROBLEM TO BE SOLVED: To provide a bending apparatus for a lead electrode by which a semiconductor device can be mounted on and removed from a receiver base, on which the semiconductor device is mounted. SOLUTION: A recess 9 which is extended to the circumferential direction is formed in a part of the outer circumferential edge of a cutting die 6, comprising an external contour whose longitudinal section, is circular. An actuate bending member 5, which comes into contact with the outer circumferential face of the cutting die 6 and which is extended along the outer circumferential face, is arranged and installed at the outside of the cutting die 6. The bending member 5 is turned and operated from a waiting position, retreated from a movement space occupied by the semiconductor device 3, when the semiconductor device is carried in and carried out, and it bends and works the lead electrode 8 into an L-shape. When the bending and working operation of the lead electrode 8 is completed, the lead bending member 5 maintains an action position as it is, the cutting die 6 is turned and operated, and the lead electrode 8 is cut into a prescribed length by the end edge of the wall surface on the lower side of the recess 9.
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