APPARATUS FOR SEALING ELECTRONIC COMPONENT WITH RESIN

摘要

PROBLEM TO BE SOLVED: To perform easily a changeover operation of rotation supporting-point to remove useless plastics pieces corresponding to the kind of an electronic component or leas frame to be molded, and increase operation efficiency of electronic component molding by means of simple structure. SOLUTION: Supporting units 4A and 4B which make a bending process holding a molded electronic component 3 are fixed on a moving table 8A and a fixed table 8B respectively, and a space L between rotating axes 8a and 8b of the supporting units 4A and 4B is provided to be changed by selectively exchanging a spacer of width D inserted between the moving table 8A and the fixed table 8B.