发明名称 COLLECTING APPARATUS OF POLISHING MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a collecting apparatus for collecting reusable polishing materials from discharged water produced in polishing process including polishing material discharged from CMP(Chemical Mechanical Polishing) used in a semiconductor manufacturing plant and the like by effectively collecting polishing particle through highly concentrated operation. SOLUTION: The collecting apparatus for collecting polishing material from discharged water in the CMP process comprises a concentrating section for introducing the discharged water in the CMP process in batch-wise way to concentrate the concentration of the polishing material to the extent of given concentration with filtration film and a washing section for adding washing water to the concentrated water obtained by the concentrating section.</p>
申请公布号 JP2002075931(A) 申请公布日期 2002.03.15
申请号 JP20000263097 申请日期 2000.08.31
申请人 KURITA WATER IND LTD 发明人 MATSUMOTO AKIRA;HAYASHI KAZUKI
分类号 B24B57/02;B01D61/14;B24B37/00;C02F1/44;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B57/02
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