发明名称 |
COLLECTING APPARATUS OF POLISHING MATERIAL |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a collecting apparatus for collecting reusable polishing materials from discharged water produced in polishing process including polishing material discharged from CMP(Chemical Mechanical Polishing) used in a semiconductor manufacturing plant and the like by effectively collecting polishing particle through highly concentrated operation. SOLUTION: The collecting apparatus for collecting polishing material from discharged water in the CMP process comprises a concentrating section for introducing the discharged water in the CMP process in batch-wise way to concentrate the concentration of the polishing material to the extent of given concentration with filtration film and a washing section for adding washing water to the concentrated water obtained by the concentrating section.</p> |
申请公布号 |
JP2002075931(A) |
申请公布日期 |
2002.03.15 |
申请号 |
JP20000263097 |
申请日期 |
2000.08.31 |
申请人 |
KURITA WATER IND LTD |
发明人 |
MATSUMOTO AKIRA;HAYASHI KAZUKI |
分类号 |
B24B57/02;B01D61/14;B24B37/00;C02F1/44;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B57/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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