| 发明名称 |
METHOD FOR EXTENDING LIFE OF SEMICONDUCTOR MANUFACTURING PARTS AND METHOD FOR MANUFACTURING SEMICONDUCTOR |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a method for extending life of semiconductor manufacturing parts by achieving life extension and recycling of a SiC boat. SOLUTION: A film formed in a wafer boat to be scrapped or in use, is removed and/or cleaned. Then, a poly-Si film is formed on the surface of the wafer boat. Thus, recycling and life extension of the wafer boat is achieved.</p> |
| 申请公布号 |
JP2002076099(A) |
申请公布日期 |
2002.03.15 |
| 申请号 |
JP20000254043 |
申请日期 |
2000.08.24 |
| 申请人 |
MITSUBISHI ELECTRIC CORP;SHIKOKU INSTRUMENTATION CO LTD |
发明人 |
HOSOKAWA SHIGERU |
| 分类号 |
C23C16/24;C23C16/44;H01L21/205;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
C23C16/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
