发明名称 CIRCUIT WIRING BOARD AND MULTILAYER CIRCUIT WIRING BOARD USING THE SAME AS WELL AS ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a circuit wiring board capable of satisfying electrical connecting reliability. SOLUTION: The circuit wiring board comprises a metal layer 2 having a plurality of first through holes 2a formed at a predetermined interval in a thickness direction, insulating resin layers 3 made of insulating resins laminated on both side surfaces of the layer 2 to cover both side surfaces of the layer 2 by heating and pressurizing and to close inner peripheral surfaces of the first through holes 2a, and electrical circuit wirings 4 formed on both side surfaces of the layers 3. Second through holes 1a smaller than the first holes 2a are substantially concentrically provided at a part of the layer 3 for closing the holes 2a, and the wirings 4 formed on both side surfaces of the layer 3 are conducted by utilizing the holes 1a. An elastic modulus of the insulating layer is 7 MPa or less at a temperature for laminating, heating and pressurizing.
申请公布号 JP2002076557(A) 申请公布日期 2002.03.15
申请号 JP20000268157 申请日期 2000.09.05
申请人 NITTO DENKO CORP 发明人 KANETO MASAYUKI;NAKAMURA KEI;OTA SHINYA;OKEYUI TAKUJI
分类号 H05K1/09;C22C38/00;C22C38/08;H05K1/05;H05K1/11;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/09
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