SEMICONDUCTOR MODULE AND CIRCUIT BOARD FOR CONNECTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To realize a highly reliable solder connection by considering heat resistance of a circuit board and an electronic component. SOLUTION: A semiconductor module comprises a semiconductor device having an external electrode of a solder bump, and a circuit board for connecting the electrode of the semiconductor device via a solder paste. The solder bump is constituted of a first lead-free solder. The solder paste is constituted of a second lead-free solder having a lower melting point than that of the first lead-free solder.