| 摘要 |
PROBLEM TO BE SOLVED: To mainly heat only a part to be soldered of a chip at a high temperature by remarkably reducing a space for heating as compared with prior art and to allow heating in a short time. SOLUTION: A heater for a reflowing device comprises a preheating zone 1 and a main heating zone 14 provided continuously with the zone 1. In the zone 1, support pallets 10, etc., are rotated in a viewing vehicle type in a vertical direction in a vertical heat insulation chamber 2. A heat of a temperature for not melting a cream solder of a heater 11 is blown to a printed board by a fan 13. In the zone 14, a pattern mask 18 is fixed in a heat insulation chamber 15, and a cylinder 23 is engaged with a necessary through hole. A blind cock is engaged with an unnecessary through hole. A heat of a temperature for melting the solder by a heater 21 is blown to a part to be soldered of the chip via the cylinder 23, a coiled spring 25 and a cylinder 24 by a fan 22. |
