| 摘要 |
PROBLEM TO BE SOLVED: To provide a multifunction semiconductor device in which inter-chip alignment is facilitated, effective wiring length between functional chips is shortened, working frequency range is widened, and a plurality of semiconductor chips constitute a single semiconductor device. SOLUTION: A plurality of semiconductor chips, each having a circuit formed therein, are assembled three-dimensionally where a second semiconductor chip 21 is disposed substantially perpendicular to a first semiconductor chip 11, and the first and second semiconductor chips 11 and 21 are connected electrically at a plurality of contacts.
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