| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding die for manufacturing a highly reliable semiconductor device where, after resin sealing, a substrate or a lead protruding outside a semiconductor device package is cut without causing a crack and the like with the resin. SOLUTION: A cavity 8 in which a sealed body is put is formed between a lower die 6 and an upper die 7, and at least a gate 9 for feeding the sealing resin to the cavity 8 and an air vent communicating with the cavity 8 are provided. A space with the same height as that of the air vent is formed around the cavity 8 between the lower die 6 and the upper die 7, to provide a molten bath extending part 15.
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