| 摘要 |
PROBLEM TO BE SOLVED: To enhance the washing effect to a substrate or the processing effect of etching rate, etc., by suppressing the temperature drop of treatment liquid, when the substrate is carried into a substrate processing part such as a processing vessel or the like. SOLUTION: This substrate processor is equipped with a processing vessel 1a which performs specified treatment to a wafer W by treatment liquid, the first circulation path 2 which supplies treatment liquid discharged from the processing vessel 1a again to the processing vessel 1a, the second circulation path 3 which supplies the treatment liquid discharged from the processing vessel 1a again to the processing vessel 1a, the first treatment liquid circulating pump 22 which circulates the treatment liquid within the first circulation path 2, the second treatment liquid circulating pump 32 which circulates the treatment liquid within the second circulation path 3, and the first supply regulating valve 25 and the second supply regulating valve 35 which switch the supply of treatment liquid from the first circulation path 2 to the second processing vessel 1a and the supply of treatment liquid from the second circulation path 3 to the processing vessel 1a.
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