发明名称 METHOD FOR APPLYING ELECTRICITY TO LEAD FRAME FOR SILVER STRIP BY CONTACTLESS METHOD AND APPARATUS THEREOF
摘要 PURPOSE: A method for applying electricity to a lead frame for silver strip by a contactless method is provided to prevent a shortage of a copper plate, by applying current to an electrode plate mounted in the first and second liquid baths. CONSTITUTION: Positive current is applied from a rectifier(100) to the copper plate(135) which continuously transfers. The copper plate passes through the first liquid bath(115) in which an electrolyte solution can circulate. While positive current is continuously applied to the copper plate, the copper plate passes through the second liquid bath(130) in which a stripping solution can circulate. Current is automatically applied to the copper plate by a contactless method to strip silver over-applied on the lead of the copper plate.
申请公布号 KR20020020414(A) 申请公布日期 2002.03.15
申请号 KR20000053551 申请日期 2000.09.08
申请人 SUNG WOO ELECTRONICS CO., LTD. 发明人 JUNG, JUN YEONG;YOO, JIN MUN
分类号 H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/495
代理机构 代理人
主权项
地址