| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of solder bump where a solder bump of a good shape is formed by preventing fluidity of a solder paste. SOLUTION: The forming method of a solder bump is provided where a work on which a solder paste is printed is heated so that a solder component is melted to be jointed to an electrode, thus forming a solder bump. Here, a heating process includes a first pre-heating process where the work is heated to a first pre-heating temperature T1 for promoting evaporation of a solvent component in the solder paste, which is held for a prescribed time period, a second pre-heating process where it is heated to a second pre-heating temperature T2 which is higher than the first pre-heating temperature, which is held for a prescribed time period, and a main heating process where it is raised, in temperature, to a solder melting temperature T3 so that the solder paste is melted. Thus, the fluidity of the solder paste before the main heating is prevented so that the solder bump of a good shape is formed. |
