发明名称 CHASSIS STRUCTURE FOR ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To improve a chassis structure for electronic equipment so as to reduce the size and weight of electronic equipment, to give a heat insulating function and a cooling function to the equipment, and to make the switching operation between the heat insulating function and cooling function simpler. SOLUTION: An electronic block or electronic circuit 1 is placed on a metallic tray 2. The tray 2 is heated with an electric heater 3. A temperature detecting circuit 4 controls the heater 3. The electronic block or electronic circuit 1 is surrounded by a heat transfer box 4 and the box 4 is covered with an insulated box 5. A heat sink 6S has such a structure that the effective heat radiating area of the plate 68 can be increased or decreased, is thermally coupled with the heat transfer box 4, and is in contact with the outside air through the wall of the insulated box 5.
申请公布号 JP2002076666(A) 申请公布日期 2002.03.15
申请号 JP20000268422 申请日期 2000.08.31
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OKABE KOICHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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