发明名称 ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device improving reliability by preventing a corrosion of metal wirings of an electronic circuit chip and adapted to a recent year environmental problem. SOLUTION: The electronic circuit device comprises a first board 10 having first wiring parts (11a, 12a), an electronic circuit chip 4 connected to the part 11a and mounted on the board 10, an insulating resin layer 7 formed on the board 10 and the chip 4, and a second board 20 having wiring parts (24a, 21a) formed on the layer 7. In this case, the layer 7 is constituted of a material to become a content of a halogen or the like capable of suppressing a corrosion of the wiring of the chip 4 to be contacted with.
申请公布号 JP2002076546(A) 申请公布日期 2002.03.15
申请号 JP20000252976 申请日期 2000.08.23
申请人 SONY CORP 发明人 YASUDA MASAYUKI;WATANABE YOSHIO;KANDA KENJI;NISHITANI YUJI
分类号 C08L63/00;H05K1/03;H05K1/18;(IPC1-7):H05K1/03 主分类号 C08L63/00
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