| 摘要 |
PROBLEM TO BE SOLVED: To surely carry out trimming of a copper fuse with an infrared region laser. SOLUTION: A copper fuse 1 and a copper wiring 5 that could be cut by a laser beam are formed on a silicon substrate so that the film thickness of the copper fuse 1 is thinner than that of the other copper wiring 5 in the same layer. Further by covering a side surface part and a lower surface part of copper 1a, 5a with barrier metal 1b, 5b at the copper fuse 1 and the copper wiring 5, an absorption factor of the laser beam 4 is improved, an uncut remainder is reduced, and leakage is decreased. These are manufactured by using a damascene method.
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