摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has body of an antenna, suitable for a mobile apparatus integrated with a semiconductor IC. SOLUTION: On a semiconductor IC substrate 1, formed with a plurality of circuit elements, the antenna member 11 which is constituted of a metal interconnection is provided, and the faces and upper face of the antenna element are coated with a dielectric material 12 having a relative permittivity of 10 or larger.
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