| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film capacitor, having a small mounting area, a large capacity and a low inductance. SOLUTION: The thin-film capacitor 10 comprises an insulating board 1, having a first via hole conductor 2 formed to penetrate into a thickness direction of a substrate near an outer periphery and a second via hole conductor 3, formed on a region surrounded by the first via hole conductor, and thin film capacitor elements each having a first capacity electrode (lower electrode) a thin-film dielectric layer, a second capacity electrode (upper electrode) and an insulation protective layer and disposed on front and rear surfaces of the board 1.
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