| 摘要 |
PROBLEM TO BE SOLVED: To realize a thin and lightweight power module, having low inductance in which an electrode terminal and a semiconductor chip can be connected in a short time and a fine structure formed on one side of the semiconductor chip will not be destructed. SOLUTION: A semiconductor chip 1 is bonded on the side provided with a fine structure to the lower surface of an electrode terminal 13a through solders 6a and 6b. The other side of the semiconductor chip 1 is bonded by compression to a conductor pattern 5a on the upper surface of an insulating substrate 4. Since the semiconductor chip 1 and the electrode terminal 13a can be connected, without having to use a bonding wire, connection can be made in a short time. When the bonding face between the semiconductor chip 1 and the electrode terminal 13a is enlarged, a thin and light-weight power module having a low inductance can be realized. Since solder bonding is employed, stresses hardly concentrate, even if a fine structure is formed on the upper surface of the semiconductor chip 1 and the fine structure is less likely to be destructed. |
